公开(公告)号：US20090010010A1

公开(公告)日：2009-01-08

申请号：US12043409

申请日：2008-03-06

申请人： Baoyan CHANG ,  Xianghong Yang ,  Zheng Xu

发明人： Baoyan CHANG ,  Xianghong Yang ,  Zheng Xu

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/89 ,  F21Y2115/10

摘要： The present invention provides a LED direct-plugging type multi-chip high power light source, comprising a heat dissipating substrate, a protecting rubber ring mounted at the obverse of the heat dissipating substrate, LEDs fixed on the heat dissipating substrate and in the protecting rubber ring, the heat dissipating substrate being provided with two through holes impenetrating its obverse and inverse, in each of the two through holes separately provided with a pin connecting to the LEDs, one end of the pin inserted into the through hole and the other end of the pin led out from the inverse of the heat dissipating substrate to the outside of the heat dissipating substrate, and the part of the pins inserted in the through holes being separated from the heat dissipating substrate by a dielectric. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance. The present invention increases the power of a single light source, decreases the attenuation of light greatly, and increases the useful life greatly.

摘要翻译： 本发明提供一种LED直插式多芯片大功率光源，包括散热基板，安装在散热基板正面的保护橡胶环，固定在散热基板上的LED和保护橡胶 所述散热基板在其两个通孔中分别设置有连接到所述LED的销的一个端部，插入所述通孔中的一端，并且所述散热基板的另一端分别设置有穿过其正面和反向的两个通孔， 该引脚从散热基板的反向引出到散热基板的外部，并且插入通孔中的销的部分通过电介质与散热基板分离。 散热基板由高导热金属制成。 在本发明中，散热基板由高导热性金属制成，导热柱被消除。 与现有技术相比，本发明减少了散热路径，增大了截面面积，消除了高耐热性的中间环节。 本发明增加了单个光源的功率，大大降低了光的衰减，大大提高了使用寿命。

公开(公告)号：US07686479B2

公开(公告)日：2010-03-30

申请号：US12043367

申请日：2008-03-06

申请人： Xianghong Yang ,  Baoyan Chang ,  Zheng Xu

发明人： Xianghong Yang ,  Baoyan Chang ,  Zheng Xu

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/505 ,  F21Y2105/10 ,  F21Y2105/12

摘要： The present invention provides a LED flat-plate type multi-chip high power light source comprising a heat dissipating substrate, a reflecting cover mounted on the heat dissipating substrate, a circuit board embedded in the heat dissipating substrate, LEDs mounted on the circuit board and in the reflecting cover, and the circuit board also connecting to a socket set in the heat dissipating substrate. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance.

摘要翻译： 本发明提供一种LED平板型多芯片大功率光源，包括散热基板，安装在散热基板上的反射盖，嵌入散热基板的电路板，安装在电路板上的LED和 在反射盖中，并且电路板还连接到设置在散热基板中的插座。 散热基板由高导热金属制成。 在本发明中，散热基板由高导热性金属制成，导热柱被消除。 与现有技术相比，本发明减少了散热路径，增大了截面面积，消除了高耐热性的中间环节。

公开(公告)号：US20090010009A1

公开(公告)日：2009-01-08

申请号：US12043367

申请日：2008-03-06

申请人： Xianghong Yang ,  Baoyan Chang ,  Zheng Xu

发明人： Xianghong Yang ,  Baoyan Chang ,  Zheng Xu

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/505 ,  F21Y2105/10 ,  F21Y2105/12

摘要： The present invention provides a LED flat-plate type multi-chip high power light source comprising a heat dissipating substrate, a reflecting cover mounted on the heat dissipating substrate, LEDs mounted on the heat dissipating substrate and in the reflecting cover, a circuit board embedded in the heat dissipating substrate connecting to the LEDs, and the circuit board also connecting to a socket set in the heat dissipating substrate. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance.

摘要翻译： 本发明提供一种LED平板型多芯片大功率光源，包括散热基板，安装在散热基板上的反射盖，安装在散热基板和反射盖上的LED，嵌入电路板 在连接到LED的散热基板中，并且电路板还连接到设置在散热基板中的插座。 散热基板由高导热金属制成。 在本发明中，散热基板由高导热性金属制成，导热柱被消除。 与现有技术相比，本发明减少了散热路径，增大了截面面积，消除了高耐热性的中间环节。

公开(公告)号：US07806554B2

公开(公告)日：2010-10-05

申请号：US12043409

申请日：2008-03-06

申请人： Baoyan Chang ,  Xianghong Yang ,  Zheng Xu

发明人： Baoyan Chang ,  Xianghong Yang ,  Zheng Xu

IPC分类号： F21L4/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/89 ,  F21Y2115/10

摘要： The present invention provides a LED direct-plugging type multi-chip high power light source, comprising a heat dissipating substrate, a protective rubber ring mounted at the front side of the heat dissipating substrate, LEDs fixed on the heat dissipating substrate and in the protective rubber ring, the heat dissipating substrate being provided with two through holes penetrating its front side and rear side, in each of the two through holes separately provided with a pin connected to the LEDs, one end of the pin inserted into the through hole and the other end of the pin led out from the rear side of the heat dissipating substrate to the outside of the heat dissipating substrate, and the part of the pins inserted in the through holes being separated from the heat dissipating substrate by a insulator. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance. The present invention increases the power of a single light source, decreases the attenuation of light greatly, and increases the useful life greatly.

摘要翻译： 本发明提供一种LED直插式多芯片大功率光源，包括散热基板，安装在散热基板正面的保护橡胶环，固定在散热基板上的LED和保护性的 橡胶圈，散热基板上设有穿过其前侧和后侧的两个通孔，在两个通孔中的每一个中，分别设置有连接到LED的销，插入通孔的销的一端和 销的另一端从散热基板的后侧引出到散热基板的外侧，并且插入通孔中的销的部分通过绝缘体与散热基板分离。 散热基板由高导热金属制成。 在本发明中，散热基板由高导热性金属制成，导热柱被消除。 与现有技术相比，本发明减少了散热路径，增大了截面面积，消除了高耐热性的中间环节。 本发明增加了单个光源的功率，大大降低了光的衰减，大大提高了使用寿命。