COUPLING COMPONENT APPLIED TO QUANTUM CHIP, QUANTUM CHIP AND QUANTUM COMPUTING DEVICE

    公开(公告)号:US20240049609A1

    公开(公告)日:2024-02-08

    申请号:US18126035

    申请日:2023-03-24

    Inventor: Feiyu LI Lijing JIN

    CPC classification number: H10N60/805 H10N60/12

    Abstract: Provided is a coupling component applied to a quantum chip, a quantum chip and a quantum computing device. The coupling component includes a first electrode plate and a second electrode plate. The first electrode plate includes a first coupling port and a second coupling port. The second electrode plate includes a third coupling port and a fourth coupling port. At least one of the following conditions is satisfied: a first coupling strength formed by coupling the first coupling port with a first qubit is different from a second coupling strength formed by coupling the second coupling port with a second qubit, and a third coupling strength formed by coupling the third coupling port with the first qubit is different from a fourth coupling strength formed by coupling the fourth coupling port with the second qubit.

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