公开(公告)号：US20200023441A1

公开(公告)日：2020-01-23

申请号：US16499647

申请日：2019-02-18

Applicant: Beijing Institute of Technology

Inventor： Tianfeng ZHOU ,  Benshuai RUAN ,  Jia ZHOU ,  Longlong TANG ,  Zhiqiang LIANG ,  Li JIAO ,  Zhibing LIU ,  Lijing XIE ,  Pei YA N ,  Xibin WANG

IPC: B23B1/00 ,  G01B11/06

Abstract: The present invention demonstrates a halfway cutter changing method for large-area microstructure cutting based on in-situation film thickness measurement, including the following steps: step 110: preparatory work; step 120: workpiece preliminary machining; step 130: transparent film coating; step 140: film thickness detection; step 150: halfway cutter changing; and step 160: machining completion. The halfway cutter changing method for the large-area microstructure cutting based on the in-situation film thickness measurement provided by the present invention implements machining of a microstructure with large area, high quality and high uniformity.