公开(公告)号：US5613531A

公开(公告)日：1997-03-25

申请号：US385655

申请日：1995-02-08

申请人： Bernhard Essig ,  Peter Klein ,  Karl Kornmann

发明人： Bernhard Essig ,  Peter Klein ,  Karl Kornmann

IPC分类号： H05K13/00 ,  B21F45/00

CPC分类号： H05K13/0092 ,  H01L2924/181

摘要： A device for aligning contact feet extending from the edge of an integrated circuit (IC) component has a toothed adjusting tool whose prongs are moved in the gaps between the contact feet. When the adjusting tool moves upward in the direction of the Z axis, a first adjusting plate, located below the prongs and overlapping the gaps between the prongs, comes into contact with the contact feet, which are thereby bent upward. When the adjusting tool is subsequently moved downward, a second adjusting plate, located above the prongs, comes into contact with the contact feet and bends all of them downward to a nominal size.

摘要翻译： 用于对准从集成电路（IC）部件的边缘延伸的接触脚的装置具有齿形调节工具，其尖端在接触脚之间的间隙中移动。 当调节工具沿Z轴方向向上移动时，位于插脚下方并与叉头之间的间隙重叠的第一调节板与接触脚接触，从而向上弯曲。 当调节工具随后向下移动时，位于插脚上方的第二调节板与接触脚接触并将其全部弯曲到标称尺寸。