公开(公告)号：US5777265A

公开(公告)日：1998-07-07

申请号：US861242

申请日：1997-05-21

申请人： Bidyut K. Bhattacharyya ,  Debendra Mallik ,  Ron Vitt ,  David B. Kline

发明人： Bidyut K. Bhattacharyya ,  Debendra Mallik ,  Ron Vitt ,  David B. Kline

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L24/49 ,  H01L23/49527 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107

摘要： A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates that are separated from a lead frame by a plurality of dielectric tapes. The integrated circuit is mounted to the baseplate which has a plurality of tabs that are connected to the lead frame of the package. The power or ground leads of the package are bonded to the corresponding baseplate through the tabs of the metal plate. The lead frame, metal baseplate and dielectric tapes all have center openings to provide clearance for the integrated circuit. The center opening of the tapes are such that the dielectric material extends beyond the ends of the baseplates and lead frame.

摘要翻译： 一种多层集成电路封装，其包含电介质层，其大大减少了封装金属导体之间的金属迁移。 该封装具有通过多个介质带与引线框架分离的金属基板。 集成电路安装到底板上，该底板具有连接到封装的引线框架的多个突片。 封装的电源或接地引线通过金属板的接头连接到相应的底板上。 引线框架，金属基板和介质带均具有中心开口，为集成电路提供间隙。 带的中心开口使得电介质材料延伸超过底板和引线框架的端部。