公开(公告)号：US20060277702A1

公开(公告)日：2006-12-14

申请号：US11152560

申请日：2005-06-14

申请人： Bih-tiao Lin ,  Jin Linh

发明人： Bih-tiao Lin ,  Jin Linh

IPC分类号： B08B1/04

CPC分类号： B08B1/04 ,  G01P3/486 ,  H01L21/67046

摘要： A method and system for cleaning the wafer after CMP is disclosed. A brush module having at least two brushes placed adjacent to each other and having the wafer placed in between. A dummy roller is in contact with an edge of the wafer and follows a rotation of the wafer, wherein when the wafer is rotated, the brushes clean both sides of the wafer, and the dummy roller detects a rotation speed and a rotation direction of the wafer for adjusting the rotation of the wafer.

摘要翻译： 公开了一种用于在CMP之后清洁晶片的方法和系统。 具有至少两个刷子的刷子模块，其彼此相邻放置并且将晶片放置在其间。 虚拟辊与晶片的边缘接触并跟随晶片的旋转，其中当晶片旋转时，刷子清洁晶片的两侧，并且虚拟辊检测到转动速度和旋转方向 用于调整晶片旋转的晶片。

公开(公告)号：US07685667B2

公开(公告)日：2010-03-30

申请号：US11152560

申请日：2005-06-14

申请人： Bih-tiao Lin ,  Jin Lung Linh

发明人： Bih-tiao Lin ,  Jin Lung Linh

IPC分类号： B08B11/00 ,  B08B11/02

CPC分类号： B08B1/04 ,  G01P3/486 ,  H01L21/67046

摘要： A method and system for cleaning the wafer after CMP is disclosed. A brush module having at least two brushes placed adjacent to each other and having the wafer placed in between. A dummy roller is in contact with an edge of the wafer and follows a rotation of the wafer, wherein when the wafer is rotated, the brushes clean both sides of the wafer, and the dummy roller detects a rotation speed and a rotation direction of the wafer for adjusting the rotation of the wafer.

摘要翻译： 公开了一种用于在CMP之后清洁晶片的方法和系统。 具有至少两个刷子的刷子模块，其彼此相邻放置并且将晶片放置在其间。 虚拟辊与晶片的边缘接触并跟随晶片的旋转，其中当晶片旋转时，刷子清洁晶片的两侧，并且虚拟辊检测到转动速度和旋转方向 用于调整晶片旋转的晶片。