公开(公告)号：US20230383154A1

公开(公告)日：2023-11-30

申请号：US18032598

申请日：2021-10-20

Applicant: Bostik, Inc.

Inventor： Deepa PUTHANPARAMBU ,  Tatiana KRETLOW ,  Joshua T. HARJU ,  Marie HUT

IPC: C09J167/03

CPC classification number: C09J167/03 ,  C09J2301/312

Abstract: A method of adhering substrate surfaces to one another comprises applying a copolyester resin mixture to the surfaces and contacting the surfaces with one another in the absence of heat to form a cold seal. The copolyester resin may be sulfonated and the reaction product of (a) at least two diols comprising ethylene glycol at a mole fraction of at least about 0.25 and (b) at least three diacids or diesters comprising: (i) a sulfomonomer at a mole fraction of at least 0.02, preferably at least 0.07; (ii) at least one aromatic diacid or diester; and (iii) at least one aliphatic diacid or diester. The ratio of aromatic to aliphatic diacids or diesters may be between about 75/25 and about 45/55, and the glass transition temperature of the resin may be between about −25° C. and about 15° C. The resin may be solvated and preferably is food grade compliant and compostable.