公开(公告)号：US06898065B2

公开(公告)日：2005-05-24

申请号：US10205991

申请日：2002-07-26

申请人： Brad Mays ,  Tetsuya Ishikawa ,  Sergio Fukuda Shoji

发明人： Brad Mays ,  Tetsuya Ishikawa ,  Sergio Fukuda Shoji

IPC分类号： H01L21/683 ,  H01T23/00

CPC分类号： H01L21/6833

摘要： A method and apparatus for a mixed-mode operation of an electrostatic chuck in a semiconductor substrate processing system. The chuck is operated in a voltage mode before and after a processing and is operated in a current mode during the processing to suppress arcing during the processing of a substrate.

摘要翻译： 一种用于半导体衬底处理系统中的静电卡盘的混合模式操作的方法和装置。 卡盘在处理之前和之后以电压模式操作，并且在处理期间以电流模式操作以在基板的处理期间抑制电弧。

公开(公告)号：US06575622B2

公开(公告)日：2003-06-10

申请号：US10013183

申请日：2001-12-07

申请人： Hamid Norrbakhsh ,  Mike Welch ,  Paul Luscher ,  Siamak Salimian ,  Brad Mays

发明人： Hamid Norrbakhsh ,  Mike Welch ,  Paul Luscher ,  Siamak Salimian ,  Brad Mays

IPC分类号： G01K114

CPC分类号： H01L21/67248 ,  C30B25/16 ,  C30B31/18

摘要： The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature. These data bases are then employed during processing of a production wafer to control coolant pressure in such a manner as to minimize wafer temperature deviation from the desired temperature.

公开(公告)号：US06353210B1

公开(公告)日：2002-03-05

申请号：US09547359

申请日：2000-04-11

申请人： Hamid Norrbakhsh ,  Mike Welch ,  Paul Luscher ,  Siamak Salimian ,  Brad Mays

发明人： Hamid Norrbakhsh ,  Mike Welch ,  Paul Luscher ,  Siamak Salimian ,  Brad Mays

IPC分类号： H05B100

CPC分类号： H01L21/67248 ,  C30B25/16 ,  C30B31/18

摘要： The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature. These data bases are then employed during processing of a production wafer to control coolant pressure in such a manner as to minimize wafer temperature deviation from the desired temperature.

摘要翻译： 本发明解决了使用包括具有接近于晶片背面并且面向晶片的端部的光纤的光学或氟光学温度传感器在处理期间连续监测晶片温度的问题。 通过在一个晶片提升销中提供光纤通过的轴向空隙来容纳该光纤，而不会干扰等离子体处理。 面向晶片背面的纤维的端部与中空提升销的端部重合。 另一端通过“外部”光纤耦合到反应室外的温度探针电子设备。 本发明使用测试晶片直接进行晶片温度测量，以建立作为冷却剂压力的函数的晶片温度特性的数据库和作为晶片支撑或“固定”温度的函数的晶片温度特性的数据库。 然后在生产晶片的处理期间采用这些数据库，以便以最小化晶片温度偏离所需温度的方式来控制冷却剂压力。