公开(公告)号：US20200319355A1

公开(公告)日：2020-10-08

申请号：US16778042

申请日：2020-01-31

申请人： Brian F. AULL ,  Joseph S. Ciampi ,  Renee D. Lambert ,  Christopher Leitz ,  Karl Alexander McIntosh ,  Steven Rabe ,  Kevin Ryu ,  Daniel R. SCHUETTE ,  David Volfson

发明人： Brian F. AULL ,  Joseph S. Ciampi ,  Renee D. Lambert ,  Christopher Leitz ,  Karl Alexander McIntosh ,  Steven Rabe ,  Kevin Ryu ,  Daniel R. SCHUETTE ,  David Volfson

IPC分类号： G01T1/24 ,  H01L27/146

摘要： A chip-to-chip integration process for rapid prototyping of silicon avalanche photodiode (APD) arrays has been developed. This process has several advantages over wafer-level 3D integration, including: (1) reduced cost per development cycle since a dedicated full-wafer read-out integrated circuit (ROIC) fabrication is not needed, (2) compatibility with ROICs made in previous fabrication runs, and (3) accelerated schedule. The process provides several advantages over previous processes for chip-to-chip integration, including: (1) shorter processing time as the chips can be diced, bump-bonded, and then thinned at the chip-level faster than in a wafer-level back-illumination process, and (2) the CMOS substrate provides mechanical support for the APD device, allowing integration of fast microlenses directly on the APD back surface. This approach yields APDs with low dark count rates (DCRs) and higher radiation tolerance for harsh environments and can be extended to large arrays of APDs.