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公开(公告)号:US6127768A
公开(公告)日:2000-10-03
申请号:US73995
申请日:1998-05-07
申请人: Brian R. Stoner , Robert B. Henard , David L. Dreifus , Bradley A. Fox
发明人: Brian R. Stoner , Robert B. Henard , David L. Dreifus , Bradley A. Fox
IPC分类号: H03H9/145 , H03H9/02 , H03H9/17 , H03H9/25 , H01L41/04
CPC分类号: H03H9/02582 , H03H9/02574 , H03H9/02834
摘要: The SAW device comprises a diamond or quartz substrate as a wave propagation layer, a piezoelectric layer on the wave propagation layer and at least one interdigitated electrode on the piezoelectric layer.
摘要翻译: SAW器件包括作为波传播层的金刚石或石英衬底,波传播层上的压电层和压电层上的至少一个叉指电极。