Grounding apparatus for an electronic module
    1.
    发明申请
    Grounding apparatus for an electronic module 有权
    电子模块接地装置

    公开(公告)号:US20050118873A1

    公开(公告)日:2005-06-02

    申请号:US11032437

    申请日:2005-01-10

    IPC分类号: H01R9/05 H01R13/658 H01R9/03

    CPC分类号: H01R9/0512 H01R12/775

    摘要: An improved device and method for grounding shields of transmission lines is shown. A grounding apparatus, a connector device, and methods associated with them are shown having improved efficiency and reliability among other advantages. Devices and methods shown eliminate a dressing and attaching step of grounding numerous grounding lines to a grounding element such as a connector housing. Devices and methods shown further improve quality and reliability of grounding operations using shielded transmission lines and transmission line connectors.

    摘要翻译: 示出了用于接地传输线屏蔽的改进的装置和方法。 示出了接地装置,连接器装置和与其相关联的方法,其具有提高的效率和可靠性以及其它优点。 所示的装置和方法消除了将许多接地线接地诸如连接器壳体的接地元件的敷料和附着步骤。 显示的设备和方法进一步提高了使用屏蔽传输线和传输线连接器的接地操作的质量和可靠性。