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公开(公告)号:US20220073217A1
公开(公告)日:2022-03-10
申请号:US17447358
申请日:2021-09-10
IPC分类号: B64G1/50
摘要: A method includes coupling a radiator panel assembly to a component, and conducting heat from the component via a thermally conductive hinge into at least one base radiator panel in the radiator panel assembly. The method further includes placing the at least one base radiator panel in a position to radiate a fraction of the heat into space through a surface of the at least one base radiator panel, and dynamically varying the position of the at least one base radiator panel to vary an amount of heat loss through the at least one base radiator panel to regulate a temperature of the component.