公开(公告)号：US10241017B2

公开(公告)日：2019-03-26

申请号：US14361094

申请日：2012-11-28

申请人： Bruker Nano, Inc.

发明人： Lucas Paul Keranen ,  Syed Amanulla Syed Asif ,  Ryan Major ,  Yunje Oh

IPC分类号： G01N3/54 ,  G01N3/18 ,  G01N3/08 ,  H05B1/02 ,  H05B3/32

摘要： A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.