公开(公告)号：US20070109717A1

公开(公告)日：2007-05-17

申请号：US11598672

申请日：2006-11-14

申请人： Byoung Lee ,  Hae Chung ,  Dong Park ,  Min Park ,  Sang Park ,  Sung Wi

发明人： Byoung Lee ,  Hae Chung ,  Dong Park ,  Min Park ,  Sang Park ,  Sung Wi

IPC分类号： H01G4/005

CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/232

摘要： A multilayer chip capacitor includes a capacitor body having dielectric layers, and internal electrode layers separated from each other in the capacitor body by the dielectric layers. Each internal electrode layer has one or two leads and includes at least one coplanar electrode plate. External electrodes are electrically connected to the internal electrode layers via the leads. The internal electrode layers constitute a plurality of blocks stacked repeatedly. Each block includes a plurality of the internal electrode layers stacked successively. The leads extending to a face of the capacitor body are arranged in a zigzag shape along a stacking direction. The leads of vertically adjacent ones of the electrode plates having opposite polarities are arranged to be horizontally adjacent to each other.

摘要翻译： 多层片状电容器包括具有电介质层的电容器主体，以及通过电介质层在电容器主体中彼此分离的内部电极层。 每个内部电极层具有一个或两个引线并且包括至少一个共面电极板。 外部电极通过引线电连接到内部电极层。 内部电极层构成反复堆叠的多个块。 每个块包括依次层叠的多个内部电极层。 延伸到电容器主体的表面的引线沿堆叠方向布置成Z字形。 具有相反极性的垂直相邻电极板的引线被布置成水平相邻。