公开(公告)号：US20230373215A1

公开(公告)日：2023-11-23

申请号：US18364234

申请日：2023-08-02

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Higuchi

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1623 ,  B41J2/1618 ,  B41J2/14201

Abstract: A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.

公开(公告)号：US20220274406A1

公开(公告)日：2022-09-01

申请号：US17673115

申请日：2022-02-16

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Higuchi

IPC: B41J2/16 ,  B41J2/14

Abstract: A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.

公开(公告)号：US10696048B2

公开(公告)日：2020-06-30

申请号：US16184858

申请日：2018-11-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Takayuki Kamimura ,  Masataka Kato ,  Hiroshi Higuchi ,  Atsunori Terasaki ,  Shuichi Tamatsukuri

IPC: B41J2/16 ,  G03F7/36 ,  B41J2/14

Abstract: A method of manufacturing an inkjet head substrate is provided. The inkjet head substrate includes an ink supply port having a through portion and a non-through portion, and the non-through portion is disposed at a position closer than the through portion to the energy generating element. The method includes disposing a mask having an opening that has a relatively large opening-width portion and a relatively small opening-width portion. The method also includes forming the through portion in the substrate at a position corresponding to the relatively large opening-width portion and the non-through portion in the substrate at a position corresponding to the relatively small opening-width portion by performing reactive ion etching on the substrate through the opening of the mask in one operation.

公开(公告)号：US20150360470A1

公开(公告)日：2015-12-17

申请号：US14728065

申请日：2015-06-02

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yoshinao Ogata ,  Seiko Minami ,  Masataka Kato ,  Masaya Uyama ,  Toshiyasu Sakai ,  Hiroshi Higuchi

IPC: B41J2/16

CPC classification number: B41J2/1628 ,  B41J2/1603 ,  B41J2/1631 ,  B41J2/1645

Abstract: A method of forming a through-substrate having a first surface and a second surface opposite to the first surface, the method causing the first surface to communicate with the second surface through the substrate, the method including: a first step that forms a first trench from the first surface side of the substrate using dry etching, the first trench having side surfaces on which protective film is formed; and a second step that forms a second trench from the second surface side using dry etching, the second trench communicating with the first trench having the side surfaces on which the protective film is formed.

Abstract translation: 一种形成具有第一表面和与第一表面相对的第二表面的通孔的方法，所述方法使得所述第一表面通过所述基板与所述第二表面连通，所述方法包括：第一步骤，形成第一沟槽 使用干蚀刻从基板的第一表面侧，第一沟槽具有形成有保护膜的侧表面; 以及第二步骤，其使用干蚀刻从所述第二表面侧形成第二沟槽，所述第二沟槽与形成有所述保护膜的侧表面的所述第一沟槽连通。

公开(公告)号：US12151479B2

公开(公告)日：2024-11-26

申请号：US18364234

申请日：2023-08-02

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Higuchi

IPC: B41J2/16 ,  B41J2/14

Abstract: A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.

公开(公告)号：US10518531B2

公开(公告)日：2019-12-31

申请号：US16009459

申请日：2018-06-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Higuchi ,  Toshiyasu Sakai ,  Masataka Kato ,  Takayuki Kamimura

IPC: B41J2/01 ,  B41J2/14

Abstract: Provided is a liquid ejection head substrate, in which a plurality of units are arranged. Each of the units includes: a pressure generating element formed on a first surface of a support substrate; and a pair of independent liquid chambers, which are formed on both sides of the pressure generating element so as to be opposed to each other, and are opened to the first surface of the support substrate. The liquid ejection head substrate includes, in the support substrate: a first common liquid chamber communicating to a plurality of independent liquid chambers on one side of the pair of independent liquid chambers; a second common liquid chamber communicating to a plurality of independent liquid chambers on another side of the pair of independent liquid chambers; and a partition wall separating the first common liquid chamber and the second common liquid chamber from each other.

公开(公告)号：US09511588B2

公开(公告)日：2016-12-06

申请号：US14518946

申请日：2014-10-20

Applicant: CANON KABUSHIKI KAISHA

Inventor： Seiko Minami ,  Toshiyasu Sakai ,  Masataka Kato ,  Masaya Uyama ,  Hiroshi Higuchi ,  Yoshinao Ogata

IPC: B41J2/16

CPC classification number: B41J2/1648 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631

Abstract: A method for processing a silicon substrate, comprising the steps of providing a silicon substrate having a first surface and a second surface, forming a non-penetrated hole extending from the first surface toward the second surface side in the silicon substrate, sticking a sealing tape comprising a support member and an adhesive layer on the first surface and filling at least part of the non-penetrated hole with the adhesive layer, performing reactive ion etching from the second surface toward the first surface side to allow the reactive ion etching to reach the adhesive layer filled in the non-penetrated hole and to expose the adhesive layer, and peeling the sealing tape from the silicon substrate to form a through hole in the silicon substrate.

Abstract translation: 一种处理硅衬底的方法，包括以下步骤：提供具有第一表面和第二表面的硅衬底，在硅衬底中形成从第一表面延伸到第二表面侧的非穿透孔，将密封带 在所述第一表面上包括支撑构件和粘合剂层，并且用所述粘合剂层填充所述未穿透孔的至少一部分，从所述第二表面朝向所述第一表面侧进行反应离子蚀刻，以允许所述反应离子蚀刻达到 粘合剂层填充在未穿透的孔中并露出粘合剂层，并且从硅衬底剥离密封带以在硅衬底中形成通孔。

公开(公告)号：US09457559B2

公开(公告)日：2016-10-04

申请号：US14723312

申请日：2015-05-27

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Higuchi ,  Takayuki Kamimura

IPC: H01L21/308 ,  H01L21/3065 ,  B41J2/00

CPC classification number: B41J2/00 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1645

Abstract: A method of making a semiconductor substrate having a through-hole includes a step of forming an etching mask on a semiconductor substrate in accordance with a pattern corresponding to the through-hole, and a step of forming the through-hole by etching the semiconductor substrate, on which the etching mask has been formed, by reactive ion etching. At least a part of the pattern corresponding to the through-hole is formed so that the semiconductor substrate is exposed in a frame-like shape along the inner edge of the through-hole.

Abstract translation: 制造具有通孔的半导体衬底的方法包括根据与通孔对应的图案在半导体衬底上形成蚀刻掩模的步骤，以及通过蚀刻半导体衬底形成通孔的步骤 ，其上形成有蚀刻掩模，通过反应离子蚀刻。 形成与通孔对应的图案的至少一部分，使得半导体基板沿着通孔的内边缘以框状形状露出。

公开(公告)号：US20160159094A1

公开(公告)日：2016-06-09

申请号：US14960569

申请日：2015-12-07

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masataka Kato ,  Yoshinao Ogata ,  Toshiyasu Sakai ,  Takayuki Kamimura ,  Hiroshi Higuchi

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2002/14306 ,  B41J2002/14419 ,  B41J2202/11

Abstract: A liquid discharge head including a substrate, and an energy-generating element. The substrate is provided with a flow path that penetrates through the substrate from the first surface to a second surface, the flow path supplying the liquid from the second surface side to the first surface side. The flow path includes a plurality of first flow paths and a second flow path that is positioned on the second surface side with respect to the first flow paths. The plurality of first flow paths are open on a bottom portion of the second flow path, and the plurality of first flow paths include a long flow path relatively long in a direction perpendicular to the first surface, and a relatively short flow path. The long flow path has a flow path resistance per unit length that is smaller than that of the short flow path.

Abstract translation: 一种液体排出头，包括基底和能量产生元件。 基板设置有从第一表面穿过基板的流路到第二表面，流路从第二表面侧向第一表面侧供给液体。 流路包括多个第一流路和相对于第一流路位于第二表面侧的第二流路。 所述多个第一流路在所述第二流路的底部开放，所述多个第一流路包括在与所述第一表面垂直的方向上相对较长的长流路和相对较短的流路。 长流路的单位长度的流路阻力小于短流路的流路阻力。

公开(公告)号：US09102150B2

公开(公告)日：2015-08-11

申请号：US14330984

申请日：2014-07-14

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Higuchi ,  Makoto Terui ,  Masaya Uyama

IPC: B41J2/15 ,  B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/14032 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2002/14387 ,  Y10T29/49401

Abstract: A liquid ejection head includes a substrate, an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid, sidewall members of a liquid flow path, and an ejection port forming member that defines an ejection port from which the liquid is ejected. In the liquid ejection head, sidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member, the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member, the covering member covers the front surface of the substrate, and the ejection port forming member is formed of an inorganic material.

Abstract translation: 液体喷射头包括基板，设置在基板的前表面侧的能量产生元件，产生用于喷射液体的能量的能量产生元件，液体流路的侧壁元件和限定 喷射口，液体从其喷射。 在液体喷射头中，液体流动路径的侧壁由侧壁构件形成，并且液体流路的顶壁由喷射口形成构件形成，侧壁构件各自由芯构件形成，芯构件从 所述基板的前表面和覆盖所述芯部件的表面的覆盖部件，所述覆盖部件覆盖所述基板的前表面，所述喷射口形成部件由无机材料形成。