公开(公告)号：US10897810B2

公开(公告)日：2021-01-19

申请号：US16234829

申请日：2018-12-28

申请人： CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD

发明人： Jiwei Wen ,  Chenxia Feng ,  Liang Chen ,  Lijuan Qu

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/04

摘要： The present invention provides a high speed signal fan-out method for BGA and a PCB using the same. The method comprises: providing a printed circuit board (PCB), providing a plurality of vias and signal traces of the vias on the PCB; and providing back-drilled holes for routing of other signal traces at positions corresponding to the vias. The vias are arranged into a plurality of straight lines from an edge to the center of the PCB. The plurality of straight lines each is horizontal or vertical. The signal traces of the vias in a straight line are arranged from high to low or from low to high with respect to routing positions of the vias, and the back-drilled holes of the plurality of vias are arranged in descending or ascending order corresponding to the depths of the back-drilled holes.