公开(公告)号：US20190103532A1

公开(公告)日：2019-04-04

申请号：US15724016

申请日：2017-10-03

Applicant: CENTER FOR INTEGRATED SMART SENSORS FOUNDATION

Inventor： Keon Jae Lee ,  Han Eol Lee ,  Do Hyun Kim ,  Jung Ho Shin ,  Seong Kwang Hong

IPC: H01L33/62 ,  H01L23/538 ,  H01L23/00 ,  A61B5/00 ,  A61N5/06

Abstract: A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.

公开(公告)号：US10290785B2

公开(公告)日：2019-05-14

申请号：US15724016

申请日：2017-10-03

Applicant: CENTER FOR INTEGRATED SMART SENSORS FOUNDATION

Inventor： Keon Jae Lee ,  Han Eol Lee ,  Do Hyun Kim ,  Jung Ho Shin ,  Seong Kwang Hong

IPC: H01L33/62 ,  H01L23/00 ,  A61B5/00 ,  A61N5/06 ,  H01L23/538

Abstract: A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.