公开(公告)号：US12156371B2

公开(公告)日：2024-11-26

申请号：US17735765

申请日：2022-05-03

Applicant: CGG SERVICES SAS

Inventor： Laurent Clerc ,  Jean-Yves Blanc ,  Emilie Lelogeais

IPC: H05K7/20

Abstract: A system for cooling an electronic component includes a cylindrical container, a support, a heat exchanger, and one or more micropumps. The cylindrical container includes an internal volume that stores dielectric liquid. The internal volume is formed by an interior wall and a bottom of the cylindrical container. The support is positioned in the internal volume of the cylindrical container, and retains the electronic component within the dielectric liquid stored in the internal volume of the cylindrical container. The support also controls a flow of the dielectric liquid. The heat exchanger is positioned in the cylindrical container and circulates water from an external environment of the cylindrical container into and out of the internal volume of the cylindrical container. The one or more micropumps are integrally formed with and powered by the electronic component, and circulate the dielectric liquid through the electronic component.