公开(公告)号：US20110076859A1

公开(公告)日：2011-03-31

申请号：US12702388

申请日：2010-02-09

Applicant: CHI-CHANG TSAI

Inventor： CHI-CHANG TSAI

IPC: H01R13/03 ,  H01R12/00 ,  H01R13/02

CPC classification number: H01R13/03 ,  H05K3/366

Abstract: A motherboard includes a printed circuit board and plural connectors. The connectors, which include sockets and ports, are mounted on the printed circuit board. Each of the connectors has plural conductive terminals. Each conductive terminal has a substrate layer and an electroplating layer formed on surfaces of the substrate layer. The electroplating layer has a thickness between 0.000128 mm. and 0.00128 mm. The electroplating layer can use the material of Au, Ag, Pt or Pd.

Abstract translation: 主板包括印刷电路板和多个连接器。 包括插座和端口的连接器安装在印刷电路板上。 每个连接器具有多个导电端子。 每个导电端子具有形成在基底层的表面上的基底层和电镀层。 电镀层的厚度为0.000128mm。 和0.00128mm。 电镀层可以使用Au，Ag，Pt或Pd的材料。