ELECTRONIC DEVICE WITH HEAT DISSIPATING MODULE
    1.
    发明申请
    ELECTRONIC DEVICE WITH HEAT DISSIPATING MODULE 审中-公开
    具有散热模块的电子设备

    公开(公告)号:US20130070419A1

    公开(公告)日:2013-03-21

    申请号:US13483305

    申请日:2012-05-30

    IPC分类号: H05K7/20

    摘要: An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a first heat dissipating piece attached to the heat pipe and a resilient piece. The resilient piece includes a securing portion secured to the first heat dissipating piece and a resilient arm. The resilient arm is engaged in the through hole to secure the first heat dissipating piece to the body. The first heat dissipating piece abuts the first heat generating part, and the resilient arm is elastically deformable to disengage from the through hole.

    摘要翻译: 电子设备包括电路板和散热模块。 电路板包括主体和位于主体上的第一发热部。 主体限定了靠近第一发热部分的通孔。 散热模块包括热管,附接到热管的第一散热片和弹性片。 弹性件包括固定到第一散热片和弹性臂的固定部分。 弹性臂接合在通孔中,以将第一散热片固定到身体上。 第一散热片邻接第一发热部分,弹性臂可弹性变形以与通孔脱离接触。

    ELECTRONIC DEVICE WITH HEAT SINK
    2.
    发明申请
    ELECTRONIC DEVICE WITH HEAT SINK 审中-公开
    具有散热的电子设备

    公开(公告)号:US20130161074A1

    公开(公告)日:2013-06-27

    申请号:US13596718

    申请日:2012-08-28

    IPC分类号: H05K7/20

    摘要: An electronic device includes a circuit board and a heat sink . A heat generating part is located on the circuit board. Through holes are defined in the circuit board. The heat sink includes a main body and resilient pieces located on the main body. The resilient pieces includes a latching portion and a resisting portion located on the latching portion. The latching portion extends through the through hole to engage with the circuit board. The resisting portion is received in the through hole and abuts the circuit board. The main body closely abuts the heat generating part. The latching portion can be disengaged from the circuit board simply by squeezing the resisting portion.

    摘要翻译: 电子设备包括电路板和散热器。 发热部位于电路板上。 电路板中定义了通孔。 散热器包括主体和位于主体上的弹性片。 弹性件包括锁定部分和位于闩锁部分上的阻挡部分。 闩锁部分延伸穿过通孔以与电路板接合。 阻力部分被容纳在通孔中并且邻接电路板。 主体紧贴发热部分。 简单地通过挤压阻挡部分,可以将闩锁部分与电路板脱离。