公开(公告)号：US20100009501A1

公开(公告)日：2010-01-14

申请号：US12585465

申请日：2009-09-16

申请人： CHUNG-ER HUANG ,  CHIH-HAO LIAO

发明人： CHUNG-ER HUANG ,  CHIH-HAO LIAO

IPC分类号： H01L21/50

CPC分类号： H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/14

摘要： A packaging structure applied for a surface mounting process, comprising: a chip module having a packaging surface; and a pre-cured layer formed on the packaging surface of the chip module. As above-mentioned, the structure is employed for protecting the external surface of the wafer. The pre-cured layer is formed on pre-curing a gluing material and the gluing material is uniformly filled with the space between the connecting protrusions on the packaging surface. The pre-cured later is post-curing in a connecting process for mounting the connecting protrusions to the substrate so that the connecting strength is improved. Moreover, the rate of the packaging process is increasing.

摘要翻译： 一种应用于表面安装工艺的包装结构，包括：具有包装表面的芯片模块; 以及形成在芯片模块的封装表面上的预固化层。 如上所述，该结构用于保护晶片的外表面。 预固化层通过对胶合材料进行预固化而形成，并且胶合材料均匀地填充在包装表面上的连接突起之间的空间。 预固化后的是在将连接突起安装到基板上的连接过程中后固化，从而提高连接强度。 此外，包装过程的速度也在增加。