公开(公告)号：US20240431022A1

公开(公告)日：2024-12-26

申请号：US18337572

申请日：2023-06-20

Applicant: CIENA CORPORATION

Inventor： Maxime Jacques ,  Michael Vitic ,  Jean-Frédéric Gagné ,  Simon Paradis

IPC: H05K1/02

Abstract: Aspects of the subject disclosure may include, for example, a flexible printed circuit (FPC) for interconnecting an optical device and an application specific integrated circuit (ASIC), wherein the FPC includes a first section that is configured with a first plurality of electrically conductive traces and a second section over which one or more components are disposed, and wherein the second section is configured with a second plurality of electrically conductive traces that extend from the first plurality of electrically conductive traces to the one or more components. Other embodiments are disclosed.