公开(公告)号：US09619675B2

公开(公告)日：2017-04-11

申请号：US14247618

申请日：2014-04-08

申请人： CIRQUE CORPORATION

发明人： Jared G. Bytheway ,  Steven C. Peterson

IPC分类号： G06F21/60 ,  G06F21/86 ,  G06F21/55

CPC分类号： G06F21/86 ,  G06F21/558 ,  G06F21/755 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137

摘要： A system and method for disposing a capacitive proximity and touch sensor in locations where an integrated circuit package may be vulnerable to intrusion by providing electrodes in the packaging that may prevent interception of data obtained by a probe that is brought into proximity of the integrated circuit.

公开(公告)号：US20140304826A1

公开(公告)日：2014-10-09

申请号：US14247618

申请日：2014-04-08

申请人： CIRQUE CORPORATION

发明人： Jared G. Bytheway ,  Steven C. Peterson

IPC分类号： G06F21/60

CPC分类号： G06F21/86 ,  G06F21/558 ,  G06F21/755 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137

摘要： A system and method for disposing a capacitive proximity and touch sensor in locations where an integrated circuit package may be vulnerable to intrusion by providing electrodes in the packaging that may prevent interception of data obtained by a probe that is brought into proximity of the integrated circuit.

摘要翻译： 一种用于在集成电路封装可能容易受到入侵的位置处布置电容式接近和触摸传感器的系统和方法，该电路可以通过在封装中提供电极来防止截取由集成电路附近的探头获得的数据。