公开(公告)号：US20210118940A1

公开(公告)日：2021-04-22

申请号：US17072460

申请日：2020-10-16

申请人： Commissariat a l'Energie Atomique et aux Energies Alternatives

发明人： Bertrand CHAMBION ,  Jean-Philippe COLONNA

IPC分类号： H01L27/146

摘要： A process includes providing electronic chips, the chips having been diced beforehand and each including a stack including a matrix-array of pixels, an interconnect layer, first layer, joining the electronic chips to a carrier substrate, so as to leave a spacing region between the chips; forming a redistribution layer having lateral ends extending into each spacing region; forming metal pillars on the lateral ends; moulding a material including first segments, facing the first layers, second segments which are separate from the first segments, and which extend around the metal pillars; the first and second segments being coplanar; applying a heat treatment, the formed material being chosen so that the stack is curved with a convex shape; the second segments remaining coplanar at the end.

公开(公告)号：US20230115626A1

公开(公告)日：2023-04-13

申请号：US17938783

申请日：2022-10-07

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Jean-Philippe COLONNA ,  Jean BRUN ,  Sami OUKASSI

IPC分类号： H01M10/0585 ,  H01M10/0562 ,  H01M50/562

摘要： A battery includes, stacked successively above a first face of a support, in a stacking direction, at least a cathode including a lower face, an upper face and a side wall directed in the stacking direction from the lower face to the upper face, a solid electrolyte, an anode, the battery including a coating portion surrounding, and in contact with, all of the side wall of the cathode, without covering the upper face of the cathode.