公开(公告)号：US12104267B2

公开(公告)日：2024-10-01

申请号：US17965158

申请日：2022-10-13

Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED

Inventor： Yi Lu ,  Xiaosong Liu ,  Keqiang Li

IPC: C25D21/06

CPC classification number: C25D21/06

Abstract: This application relates to a filtering mechanism and a device for producing a conductive material, where the filtering mechanism includes a filtering body, a cover, and a supporting member. The filtering body includes an accommodating cavity for accommodating an electroplating material and an opening provided on the filtering body; the cover is configured to cover the opening and connect to the filtering body to enclose the electroplating material in the filtering body; and the supporting member is provided on the cover to enhance connection strength between the cover and the filtering body.

公开(公告)号：US20240309515A1

公开(公告)日：2024-09-19

申请号：US18676513

申请日：2024-05-29

Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED

Inventor： Keqiang Li ,  Xiaosong Liu ,  Zhiyang Wu ,  Yi Lu

IPC: C23F1/08 ,  C23F1/02

CPC classification number: C23F1/08 ,  C23F1/02

Abstract: Provided an etching device that is capable of effectively realizing an opening structure with low cost and simplified process. The etching device includes: a porous roller, the porous roller being a hollow structure with openings at both ends, an etching liquid being accommodated in the hollow structure, and the porous roller being provided with a plurality of openings; a pressing roller, attached to the porous roller and arranged above the liquid level of the etching liquid, for pressing and attaching a metal layer to be etched onto the surface of the porous roller; wherein during rotation of the porous roller, the etching liquid passes through at least part of the openings of the plurality of openings and continuously soaks the metal layer in contact with the at least part of the openings, so as to continuously etch the metal layer in contact with the at least part of the openings.

公开(公告)号：US20240327972A1

公开(公告)日：2024-10-03

申请号：US18735190

申请日：2024-06-06

Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED

Inventor： Keqiang Li ,  Xiaosong Liu ,  Zhiyang Wu ,  Yi Lu

IPC: C23C14/24 ,  C23C14/04 ,  C23C14/20

CPC classification number: C23C14/24 ,  C23C14/042 ,  C23C14/20

Abstract: Provided are a coating apparatus that can form a high-accuracy pattern coating on a base film, thereby improving the performance of components including the base film (such as current collectors). The coating apparatus includes: a coating-resistance pattern unit configured to form a pattern composed of a coating-resistance substance on a partial area of the surface of a base film, where the coating-resistance substance is used to restrict metal vapor from forming a coating; and a coating unit configured to apply the metal vapor to the base film with the pattern, so as to form a metal coating on the area of the surface of the base film where the coating-resistance substance is not provided.