公开(公告)号：US20130021128A1

公开(公告)日：2013-01-24

申请号：US13626619

申请日：2012-09-25

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： Yipeng Yan ,  Robert J. Bogert ,  Baoqi Wang

IPC: H01F27/02 ,  H01F41/00

CPC classification number: H01F27/38 ,  H01F3/14 ,  H01F17/045 ,  H01F27/292 ,  Y10T29/4902

Abstract: Low profile, shielded magnetic components for circuit board applications include self centering core and coil assemblies with coil receptacle and centering projections formed in core pieces that are assembled around a preformed coil. Welding and plating techniques for forming termination structure for the preformed coil avoid thermal shock issues. External gapping elements and agents to form a gapped core structure are avoided, and gap size in the cores may be tightly controlled over large production lot sizes.

Abstract translation: 用于电路板应用的薄型屏蔽磁性部件包括具有线圈插座的自定心芯和线圈组件，以及围绕预成型线圈组装的芯片中形成的定心突起。 用于形成预制线圈的端接结构的焊接和电镀技术避免了热冲击问题。 避免形成间隙芯结构的外部间隙元件和试剂，并且可以在大的生产批量尺寸上严格控制芯中的间隙尺寸。