公开(公告)号：US20210031493A1

公开(公告)日：2021-02-04

申请号：US16983026

申请日：2020-08-03

Applicant: CORNING INCORPORATED

Inventor： Jeffrey M Benjamin ,  Ward Tyson Knickerbocker ,  Jinfa Mou ,  Kevin Andrew Vasilakos ,  Po Ki Yuen

IPC: B32B17/06 ,  B32B7/12 ,  B32B7/027

Abstract: Various examples of the present disclosure provide a cold-formed glass assembly. The assembly includes a curved glass substrate and a curved structural frame. A coefficient of thermal expansion between the curved glass substrate and the curved structural frame are different. An adhesive can be disposed between the curved glass substrate and the curved structural frame. The assembly can further include an elastomeric layer, a matrix material or both in contact with the adhesive and disposed between the curved glass substrate and the curved structural frame.