公开(公告)号：US20190154931A1

公开(公告)日：2019-05-23

申请号：US16253024

申请日：2019-01-21

Applicant: CORNING OPTICAL COMMUNICATIONS LLC

Inventor： Leonard Thomas Masters ,  Robert Adam Modavis ,  James Scott Sutherland

IPC: G02B6/42

Abstract: Optical assemblies, interconnection substrates and methods of forming optical links are disclosed. In one embodiment, an optical assembly includes a first waveguide substrate, a second waveguide substrate, and an interconnection substrate having a first end face, a second end face, and a laser written waveguide. The first waveguide substrate is coupled to the first end face of the interconnection substrate, and the first waveguide is optically coupled to the laser written waveguide. The laser written waveguide terminates at the second end face of the interconnection substrate. The second waveguide substrate is coupled to the second end face of the interconnection substrate such that the second waveguide is optically coupled to the laser written waveguide at the second end face.