RESIN COMPOSITION
    2.
    发明申请

    公开(公告)号:US20210395420A1

    公开(公告)日:2021-12-23

    申请号:US17280060

    申请日:2019-10-01

    申请人: CUBICURE GMBH

    摘要: A resin composition for three dimensional printing at elevated temperatures forming high temperature-resistant materials, the resin composition comprising a heat curable component A having one or more chemical species chosen from the group comprised of monomers and/or oligomers and/or prepolymers of maleimide derivatives according to formula and a light-curable component B having one or more chemical species chosen from the group comprised of (meth)acrylate, (meth)acrylamide, vinyl esters, vinyl ether, vinyl, allyl, alkinyl or styrenic compounds as well as derivatives thereof substituted with at least one molecule from the group from which component A is chosen, wherein the amount of component A ranges from 30 wt % to 95 wt % based on the total weight of components A and B and the amount of the light-curable component B ranges from 5 to 70 wt %, based on the total weight of components A and B.