公开(公告)号：US06729945B2

公开(公告)日：2004-05-04

申请号：US09823722

申请日：2001-03-30

申请人： Cangshan Xu ,  Jeff Gasparitsch ,  Robert Taff ,  Kenneth J. Bahng ,  Paul Stasiewicz ,  Erik H. Engdahl

发明人： Cangshan Xu ,  Jeff Gasparitsch ,  Robert Taff ,  Kenneth J. Bahng ,  Paul Stasiewicz ,  Erik H. Engdahl

IPC分类号： B24B2108

CPC分类号： B24B37/16 ,  B24B21/04

摘要： A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen includes a leading zone containing a first plurality of output holes. The leading zone is oriented more proximate to an upstream region of the linear polishing pad. The platen also includes a trailing zone containing a second plurality of output holes. The trailing zone is oriented more proximate to a downstream region of the linear polishing pad. The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.

摘要翻译： 公开了一种用于化学机械平面化（CMP）系统的压板。 压板布置在线性抛光垫的下方，并设计成将受控流体流施加到线性抛光垫的下侧。 台板包括一个包含第一多个输出孔的引导区。 前导区域更接近于线性抛光垫的上游区域。 压盘还包括包含第二多个输出孔的拖尾区域。 拖尾区域更靠近直线抛光垫的下游区域。 引导区域和拖尾区域被独立地控制和设计成独立于第一多个输出孔和第二多个输出孔中的每一个输出受控流体流动。

公开(公告)号：US06645046B1

公开(公告)日：2003-11-11

申请号：US09607743

申请日：2000-06-30

申请人： Michael Vogtmann ,  Chris Frederickson ,  Jeff Gasparitsch ,  Gene Hempel ,  Erik Engdahl

发明人： Michael Vogtmann ,  Chris Frederickson ,  Jeff Gasparitsch ,  Gene Hempel ,  Erik Engdahl

IPC分类号： B24B4900

CPC分类号： B24B53/017 ,  B24B21/04 ,  B24B49/16 ,  B24B53/10

摘要： A method and apparatus for conditioning a polishing pad are described. The method includes steps of providing a chemical mechanical polishing apparatus having a polishing region and a conditioning region; cycling a polishing member through the apparatus; contacting the polishing member in the conditioning region with a conditioning member; and conditioning the polishing member. The apparatus includes an end effector adapted to receive a conditioning member, the end effector being attached to an arm that can be moved horizontally and vertically, and a strain gauge that monitors the force applied to a polishing member.

摘要翻译： 描述了一种用于调节抛光垫的方法和装置。 该方法包括提供具有抛光区域和调节区域的化学机械抛光装置的步骤; 通过该装置循环抛光构件; 将调理区域中的抛光构件与调节构件接触; 并调理抛光部件。 该装置包括适于接收调节构件的末端执行器，末端执行器附接到可以水平和垂直移动的臂，以及应变计，其监测施加到抛光构件的力。