公开(公告)号：US20100219422A1

公开(公告)日：2010-09-02

申请号：US12711921

申请日：2010-02-24

申请人： Chao-Hsuan SU ,  Lu-Ming LAI ,  Ying-Zhong CHEN

发明人： Chao-Hsuan SU ,  Lu-Ming LAI ,  Ying-Zhong CHEN

IPC分类号： H01L33/00

CPC分类号： H01L31/167 ,  H01L31/0203

摘要： A photo-coupler is provided. The photo-coupler comprises a light emitting chip, a light-sensing chip, a light-transmissive inner encapsulant package and an outer package. Both the light emitting chip and the light-sensing chip face the same direction, while the light-sensing chip receives a light beam emitted by the light emitting chip. The light-transmissive inner encapsulant package encloses the light emitting chip and the light-sensing chip, while the outer package encloses the light-transmissive inner encapsulant package. An interface is formed between the light-transmissive inner encapsulant package and the outer package for reflecting the light beam. A reflective curve surface adjacent to the light emitting chip is formed on the interface of the light-transmissive inner encapsulant package for reflecting and converging the first portion of the light beam to the light-sensing chip.

摘要翻译： 提供光耦合器。 光耦合器包括发光芯片，光感测芯片，透光内密封剂封装和外包装。 发光芯片和感光芯片都面向相同的方向，而光感测芯片接收由发光芯片发射的光束。 透光内密封剂封装封装发光芯片和光感测芯片，而外部封装包封透光内密封剂封装。 在透光内密封剂封装和外包装之间形成用于反射光束的界面。 在透光内密封剂封装的界面上形成与发光芯片相邻的反射曲面，用于将光束的第一部分反射和会聚到感光芯片。

公开(公告)号：US20110080732A1

公开(公告)日：2011-04-07

申请号：US12779460

申请日：2010-05-13

申请人： Ying-Zhong CHEN

发明人： Ying-Zhong CHEN

IPC分类号： F21S4/00 ,  F21V29/00

CPC分类号： F21V29/83 ,  F21K9/23 ,  F21V29/507 ,  F21V29/677 ,  F21V29/717 ,  F21V29/763 ,  F21Y2115/10

摘要： An illumination device. A control circuit module is disposed in a first base. A second base is detachably connected to the first base. A heat-dissipation module is disposed in the second base and is electrically connected to the control circuit module. A first fastening ring fastens the first base with the second base. A third base is detachably connected to the second base. A light source module is disposed in the third base and is electrically connected to the heat-dissipation module. A second fastening ring fastens the second base with the third base.

摘要翻译： 照明装置。 控制电路模块设置在第一基座中。 第二基座可拆卸地连接到第一基座。 散热模块设置在第二基座中并与控制电路模块电连接。 第一紧固环用第二底座固定第一基座。 第三基座可拆卸地连接到第二基座。 光源模块设置在第三基座中并与散热模块电连接。 第二紧固环用第三底座固定第二基座。