公开(公告)号：US20130075764A1

公开(公告)日：2013-03-28

申请号：US13288747

申请日：2011-11-03

Applicant: Chao-Wei YU

Inventor： Chao-Wei YU

IPC: H01L31/12

CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/0203 ,  H01L31/173 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: An optical module package structure includes a light-emitting chip and a light sensor chip respectively installed in a first cavity and a second cavity in a substrate, a reflective layer coated on the periphery of the first cavity, two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively, and a lid integrally formed on the substrate to enhance the airtightness of the whole optical module package structure.

Abstract translation: 光学模块封装结构包括发光芯片和分别安装在基板的第一腔和第二腔中的光传感器芯片，涂覆在第一腔的周边上的反射层，分别模制在第一空腔中的两个封装粘合剂结构 第一空腔和第二腔分别封装发光芯片和光传感器芯片;以及一体地形成在基板上的盖，以增强整个光学模块封装结构的气密性。