Defect monitoring for resist layer
    1.
    发明授权
    Defect monitoring for resist layer 有权
    抗蚀剂层缺陷监测

    公开(公告)号:US08852673B2

    公开(公告)日:2014-10-07

    申请号:US13286451

    申请日:2011-11-01

    IPC分类号: G03F7/26 G03F7/40 G03F7/42

    CPC分类号: G03F7/26 G03F7/40 G03F7/405

    摘要: Methods for detecting and monitoring defects in a resist material are disclosed. In an example, a method includes forming a resist layer over a substrate; developing the resist layer; washing the developed resist layer with a thinner wash solution, wherein the washing reveals any negatively charged defects in the developed resist layer; and after the washing, inspecting for the negatively charged defects.

    摘要翻译: 公开了用于检测和监测抗蚀剂材料中的缺陷的方法。 在一个实例中,一种方法包括在衬底上形成抗蚀剂层; 显影抗蚀层; 用较薄的洗涤溶液洗涤显影的抗蚀剂层,其中洗涤显示显影的抗蚀剂层中的任何带负电荷的缺陷; 洗涤后,检查带负电的缺陷。

    DEFECT MONITORING FOR RESIST LAYER
    2.
    发明申请
    DEFECT MONITORING FOR RESIST LAYER 有权
    防腐层的缺陷监测

    公开(公告)号:US20130108775A1

    公开(公告)日:2013-05-02

    申请号:US13286451

    申请日:2011-11-01

    IPC分类号: B05D3/10

    CPC分类号: G03F7/26 G03F7/40 G03F7/405

    摘要: Methods for detecting and monitoring defects in a resist material are disclosed. In an example, a method includes forming a resist layer over a substrate; developing the resist layer; washing the developed resist layer with a thinner wash solution, wherein the washing reveals any negatively charged defects in the developed resist layer; and after the washing, inspecting for the negatively charged defects.

    摘要翻译: 公开了用于检测和监测抗蚀剂材料中的缺陷的方法。 在一个实例中,一种方法包括在衬底上形成抗蚀剂层; 显影抗蚀层; 用较薄的洗涤溶液洗涤显影的抗蚀剂层,其中洗涤显示显影的抗蚀剂层中的任何带负电荷的缺陷; 洗涤后,检查带负电的缺陷。

    ITERATIVE RINSE FOR SEMICONDUCTOR FABRICATION
    3.
    发明申请
    ITERATIVE RINSE FOR SEMICONDUCTOR FABRICATION 有权
    用于半导体制造的迭代反应

    公开(公告)号:US20120231395A1

    公开(公告)日:2012-09-13

    申请号:US13044277

    申请日:2011-03-09

    IPC分类号: G03F7/20 B08B3/00

    CPC分类号: G03F7/405 H01L21/0206

    摘要: An iterative rinse for fabrication of semiconductor devices is described. The iterative rinse includes a plurality of rinse cycles, wherein each of the plurality of rinse cycles has a different resistivity. The plurality of rinse cycles may include a first rinse of a semiconductor substrate with de-ionized (DI) water and carbon dioxide (CO2), followed by a second rinse the semiconductor substrate with DI water and CO2. The first rinse has a first resistivity; the second rinse has a second resistivity lower than the first resistivity.

    摘要翻译: 描述了用于制造半导体器件的迭代冲洗。 迭代冲洗包括多个漂洗循环,其中多个漂洗循环中的每一个具有不同的电阻率。 多个漂洗循环可以包括具有去离子(DI)水和二氧化碳(CO 2)的半导体衬底的第一次冲洗,随后用DI水和CO 2冲洗半导体衬底。 第一冲洗具有第一电阻率; 第二冲洗具有比第一电阻率低的第二电阻率。

    Iterative rinse for semiconductor fabrication
    4.
    发明授权
    Iterative rinse for semiconductor fabrication 有权
    用于半导体制造的迭代冲洗

    公开(公告)号:US08476003B2

    公开(公告)日:2013-07-02

    申请号:US13044277

    申请日:2011-03-09

    IPC分类号: G03F7/26

    CPC分类号: G03F7/405 H01L21/0206

    摘要: An iterative rinse for fabrication of semiconductor devices is described. The iterative rinse includes a plurality of rinse cycles, wherein each of the plurality of rinse cycles has a different resistivity. The plurality of rinse cycles may include a first rinse of a semiconductor substrate with de-ionized (DI) water and carbon dioxide (CO2), followed by a second rinse the semiconductor substrate with DI water and CO2. The first rinse has a first resistivity; the second rinse has a second resistivity lower than the first resistivity.

    摘要翻译: 描述了用于制造半导体器件的迭代冲洗。 迭代冲洗包括多个漂洗循环,其中多个漂洗循环中的每一个具有不同的电阻率。 多个漂洗循环可以包括具有去离子(DI)水和二氧化碳(CO 2)的半导体衬底的第一次冲洗,随后用DI水和CO 2冲洗半导体衬底。 第一冲洗具有第一电阻率; 第二冲洗具有比第一电阻率低的第二电阻率。