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    Image sensing device and packaging method thereof
    2.
    发明申请
    Image sensing device and packaging method thereof 有权
    影像感测装置及其包装方法

    公开(公告)号：US20100078747A1

    公开(公告)日：2010-04-01

    申请号：US12232936

    申请日：2008-09-26

    Applicant: Cheng-Lung Chuang ,  Chi-Cheng Lin

    Inventor： Cheng-Lung Chuang ,  Chi-Cheng Lin

    IPC: H01L27/00 ,  H01L21/00

    CPC classification number: H01L27/14618 ,  B33Y80/00 ,  H01L24/32 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: An image sensing device and a packaging method thereof is disclosed. The packaging method includes the steps of providing an adhesive layer; placing a substrate, having an opening, on the adhesive layer; disposing an image sensor within the opening on the adhesive layer; adding a filler between the image sensor and the substrate; connecting the image sensor and the substrate via a plurality of bonding wires; and removing the adhesive layer.

    Abstract translation: 公开了一种图像感测装置及其封装方法。 包装方法包括提供粘合剂层的步骤; 将具有开口的基板放置在所述粘合剂层上; 将图像传感器设置在粘合剂层上的开口内; 在图像传感器和基板之间添加填充物; 通过多个接合线连接图像传感器和基板; 并去除粘合剂层。

    Image sensing module and method for packaging the same
    3.
    发明申请
    Image sensing module and method for packaging the same 审中-公开
    图像传感模块及其封装方法

    公开(公告)号：US20080099866A1

    公开(公告)日：2008-05-01

    申请号：US11585917

    申请日：2006-10-25

    Applicant: Chia-Shuai Chang ,  Cheng-Lung Chuang ,  Chia-Ming Wu

    Inventor： Chia-Shuai Chang ,  Cheng-Lung Chuang ,  Chia-Ming Wu

    IPC: H01L31/0203 ,  H01L21/00

    CPC classification number: H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00

    Abstract: An image sensing module and a method for packaging the same are disclosed. Meanwhile, the packaging method includes the steps of a) providing a substrate; b) forming plural passive devices on the substrate; c) adhering a chip on the substrate and bonding thereon; d) providing a ring frame, wherein the ring frame includes an opening window and plural pillars for contacting with the substrate; e) adhering a glass piece on the opening window to form a lid assembly; f) covering the lid assembly on the substrate, wherein the plural pillars contacting with the substrate, the plural passive devices and the chip are covered by the lid assembly, and plural gaps are formed between the ring frame and edges of the substrate; and g) filling a filler into the plural gaps to seal the plural passive devices and the chip in the lid assembly and the substrate.

    Abstract translation: 公开了一种图像感测模块及其封装方法。 同时，包装方法包括以下步骤：a）提供衬底; b）在衬底上形成多个无源器件; c）将芯片粘附在基板上并在其上粘接; d）提供环形框架，其中所述环形框架包括开口窗和用于与所述基板接触的多个柱; e）将玻璃片粘贴在开口窗上以形成盖组件; f）覆盖基板上的盖组件，其中与基板接触的多个支柱，多个无源装置和芯片被盖组件覆盖，并且在框架和基板的边缘之间形成多个间隙; 并且g）将填充物填充到所述多个间隙中以密封所述盖组件和所述基板中的所述多个被动装置和所述芯片。

    Chip package and chip packaging method
    4.
    发明申请
    Chip package and chip packaging method 审中-公开
    芯片封装和芯片封装方法

    公开(公告)号：US20080087975A1

    公开(公告)日：2008-04-17

    申请号：US11581444

    申请日：2006-10-17

    Applicant: Chia-Shuai Chang ,  Cheng-Lung Chuang ,  Chia-Ming Wu

    Inventor： Chia-Shuai Chang ,  Cheng-Lung Chuang ,  Chia-Ming Wu

    IPC: H01L31/0203 ,  H01L21/00

    CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014

    Abstract: A chip package and a chip packaging method for use in optical applications are disclosed. The packaging method includes the steps of: a) providing a substrate having a first surface and a second surface; b) bonding first passive devices on the first surface; c) adhering a first chip to the first surface; d) forming a protection cover over the first surface for covering the first passive devices and the first chip; e) bonding second passive devices on the second surface; f) adhering a second chip to the second surface; g) providing a lid assembly having a frame with an opening window and pillars for contacting with the second surface; h) laminating the lid assembly on the second passive devices and the second chip such that gaps are formed between the frame and edges of the second surface; and i) filling a filler into the gaps to seal the second passive devices and the second chip in the lid assembly.

    Abstract translation: 公开了一种用于光学应用的芯片封装和芯片封装方法。 包装方法包括以下步骤：a）提供具有第一表面和第二表面的基底; b）在第一表面上粘合第一无源器件; c）将第一芯片粘附到第一表面; d）在所述第一表面上形成用于覆盖所述第一无源器件和所述第一芯片的保护盖; e）在第二表面上粘合第二无源器件; f）将第二芯片粘附到第二表面; g）提供具有带有开口窗的框架和用于与第二表面接触的支柱的盖组件; h）将盖组件层叠在第二无源器件和第二芯片上，使得在框架和第二表面的边缘之间形成间隙; 以及i）将填料填充到间隙中以密封盖组件中的第二无源器件和第二芯片。

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