公开(公告)号：US20220029140A1

公开(公告)日：2022-01-27

申请号：US17309844

申请日：2020-08-06

申请人： Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Huan WU ,  Meishan XU ,  Wanbin LI ,  Jie XIANG ,  Ruqin ZHANG ,  Mengyang XIAN

IPC分类号： H01L51/56 ,  H01L27/32 ,  H01L51/52

摘要： The present disclosure provides a cutting method of a display module, including: providing a display module to be cut, the display module to be cut including a display panel and a spacing layer on the display panel, and the display panel including a region to be cut, the spacing layer being provided with a first through hole exposing the region to be cut, and the first through hole being provided therein with an encapsulation adhesive; and performing laser cutting on the display module to be cut at a position of the region to be cut so as to remove the region to be cut to form a cutting groove. In the laser cutting, at least part of the encapsulation adhesive is melted and covers a sidewall of the cutting groove.