公开(公告)号：US20120118871A1

公开(公告)日：2012-05-17

申请号：US12945322

申请日：2010-11-12

申请人： Chi-Sheng HUANG ,  Li-Gung Lai

发明人： Chi-Sheng HUANG ,  Li-Gung Lai

IPC分类号： H05B3/02

CPC分类号： H05B3/145 ,  H05B3/265 ,  H05B3/46

摘要： A heating structure includes at least a substrate, a carbon-material film layer which is coated on a surface of the substrate and two electrodes which are provided at two sides of the carbon-material film layer. A surface of the substrate that is coated with the carbon-material film layer is a rough surface to increase a heat transfer area between the substrate and the carbon-material film layer, thereby improving a heat transfer efficiency and at a same time, increasing an adhesive force between the carbon-material film layer and the substrate to prevent the carbon-material film layer from dropping out.

摘要翻译： 加热结构至少包括基板，涂覆在基板的表面上的碳材料膜层和设置在碳材料膜层两侧的两个电极。 涂覆有碳材料膜层的基板的表面是粗糙表面，以增加基板和碳材料膜层之间的传热面积，从而提高传热效率，并且同时增加 碳材料膜层与基板之间的粘合力，以防止碳材料膜层脱落。