公开(公告)号：US5179956A

公开(公告)日：1993-01-19

申请号：US721317

申请日：1991-06-26

申请人： Chikao Harada ,  Norio Kawamura ,  Ryuji Nakashima ,  Arihiro Takahashi ,  Toshimasa Yamazaki ,  Masanobu Yasui ,  Tatsushi Kondo

发明人： Chikao Harada ,  Norio Kawamura ,  Ryuji Nakashima ,  Arihiro Takahashi ,  Toshimasa Yamazaki ,  Masanobu Yasui ,  Tatsushi Kondo

IPC分类号： A61B5/022

CPC分类号： A61B5/02233 ,  Y10S73/04

摘要： A contact pressure sensor including a semiconductor chip having opposite surfaces, at least one pressure sensing element provided in one of the opposite surfaces of the chip, a spacer member supporting the other surface of the chip, a substrate having a surface to which the spacer member is fixed, the one surface of the chip being pressed against an object which produces a pressure, so that the at least one sensing element detects the pressure produced by the object, a first connection terminal provided in the one surface of the chip, a second connection terminal provided in the surface of the substrate, and a flexible flat cable connecting between the first and second connection terminals, the flexible flat cable being bent into two portions one of which extends along a side surface of the spacer member and the other of which extends along the surface of the substrate. The contact pressure sensor may further comprise a light-shading layer covering the one surface of the chip in which the at least one pressure sensing element is provided.

摘要翻译： 一种接触压力传感器，包括具有相反表面的半导体芯片，设置在芯片的相对表面之一中的至少一个压力感测元件，支撑芯片的另一个表面的间隔件，具有表面的基板，间隔件 被固定，芯片的一个表面被压在产生压力的物体上，使得至少一个感测元件检测由物体产生的压力，设置在芯片的一个表面中的第一连接端子，第二 连接端子，以及连接在第一和第二连接端子之间的柔性扁平电缆，柔性扁平电缆被弯曲成两个部分，其中一个沿着间隔件的侧表面延伸，另一个 沿着衬底的表面延伸。 接触压力传感器还可以包括覆盖芯片的一个表面的遮光层，其中提供至少一个压力感测元件。