公开(公告)号：US20180310441A1

公开(公告)日：2018-10-25

申请号：US15847947

申请日：2017-12-20

申请人： Chin-Hsien Chang ,  Shang-Chu Chien ,  Ting-Tuan Chang ,  Chi-Chu Chen

发明人： Chin-Hsien Chang ,  Shang-Chu Chien ,  Ting-Tuan Chang ,  Chi-Chu Chen

IPC分类号： H05K9/00 ,  H05K1/02

CPC分类号： H05K9/0024 ,  H05K1/0243 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10371

摘要： An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.