公开(公告)号：US20110303284A1

公开(公告)日：2011-12-15

申请号：US12797565

申请日：2010-06-09

申请人： Chris Jongmin Kim ,  Daebong Lee

发明人： Chris Jongmin Kim ,  Daebong Lee

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： B32B17/10798 ,  B32B17/10036 ,  B32B17/10761 ,  B32B17/10788 ,  H01L31/0443 ,  H01L31/048 ,  Y02E10/50

摘要： A method and apparatus for protecting a diode assembly of a photovoltaic module from compressive forces, tensile forces, and solder migration by providing at least one localized glass barrier are provided. According to various embodiments, a photovoltaic module including a first encasing layer, a second encasing layer, at least one photovoltaic cell disposed between the first and second encasing layers, at least one shielded diode assembly disposed on the at least one photovoltaic cell and electrically connected to the at least one photovoltaic cell, and a pottant disposed between the at least one photovoltaic cell and the second encasing layer is provided. A localized glass barrier may be used to shield the diode assembly.

摘要翻译： 提供了一种通过提供至少一个局部玻璃屏障来保护光伏组件的二极管组件免受压缩力，拉伸力和焊料迁移的方法和装置。 根据各种实施例，包括第一封装层，第二封装层，设置在第一和第二封装层之间的至少一个光伏电池的光伏模块，设置在至少一个光伏电池上的至少一个屏蔽二极管组件，并电连接 提供至少一个光伏电池，并且设置在所述至少一个光伏电池和所述第二包装层之间的电容器。 可以使用局部玻璃屏障来屏蔽二极管组件。