公开(公告)号：US07382323B2

公开(公告)日：2008-06-03

申请号：US11036015

申请日：2005-01-18

申请人： Chuan Ling Hu ,  Meng Chiu Pan ,  Shun Tian Lin ,  Chang Fa Yang ,  Kao Chung Cheng ,  Sea Fue Wang ,  Lisen Chang ,  Chang Lun Liao ,  Chia Hung Chen

发明人： Chuan Ling Hu ,  Meng Chiu Pan ,  Shun Tian Lin ,  Chang Fa Yang ,  Kao Chung Cheng ,  Sea Fue Wang ,  Lisen Chang ,  Chang Lun Liao ,  Chia Hung Chen

IPC分类号： H01Q1/24

CPC分类号： H01Q1/38 ,  H01Q1/22 ,  H01Q1/2283

摘要： A method for manufacturing microchip antenna comprises a dielectric substrate having antenna radiation conductor paths composing of at least one feeding point and multiple-curved paths; a dielectric substrate having the antenna radiation conductor paths being packaged by the material capable of adjusting easily dielectric constant; and an antennal object including antenna radiation conductor paths, feeding ends, welding spots and packaging materials. The main body of the antenna has multi-folded paths, feeding ends, welding spots, and a packaging body. The radiation wires of the antenna is built on a single or a multiple input ends on a dielectric substrate and is multi-folded wires and it is packaged by another dielectric material. The radiation wires of the antenna can be designed and manufactured in three dimension so as to reduce the area occupied by the antenna and reduce the coupling interference between the elements.

摘要翻译： 一种制造微芯片天线的方法，包括具有由至少一个馈电点和多个弯曲路径构成的天线辐射导体路径的电介质基板; 具有天线辐射导体路径的电介质基板由能够容易调节介电常数的材料封装; 以及包括天线辐射导体路径，馈电端，焊点和包装材料的触角物体。 天线的主体具有多折叠路径，馈电端，焊点和封装体。 天线的辐射线建立在电介质基板上的单个或多个输入端上，并且是多折线，并且由另一介质材料封装。 天线的辐射线可以三维设计和制造，以减少天线所占的面积，并减少元件之间的耦合干扰。