公开(公告)号：US20110068890A1

公开(公告)日：2011-03-24

申请号：US12919169

申请日：2008-12-05

申请人： Chuanren Yang ,  Hongwei Chen ,  Jihua Zhang ,  Lijun Yang

发明人： Chuanren Yang ,  Hongwei Chen ,  Jihua Zhang ,  Lijun Yang

IPC分类号： H01C7/04 ,  H01C7/02

CPC分类号： H01C1/1413 ,  H01C1/14 ,  H01C7/041 ,  H01C7/043 ,  Y10T29/49085

摘要： This invention relates to a method for thin film device. The method for manufacturing a thin film negative temperature coefficient thermistor is disclosed. It includes selecting a substrate, a temperature-sensitive layer, inner electrodes, a protective layer and end electrodes. The temperature-sensitive layer is an NTC thin film, the inner electrodes have a comb-shaped structure. The resistance value of the present invention can be regulated by changing material composition and the width, gap, length of comb-shaped electrodes, which are not influenced by the error of the thermistor physical size. In present invention, a high temperature glaze is engaged to smooth the surface of cheaper ceramic substrates. This process reduces the manufacturing cost, improves the structure, enhances the reliability and the yield and thus expands the application scope of the NTC thin film thermistor chips. The invention has an industrial practicability.

摘要翻译： 本发明涉及一种薄膜器件的方法。 公开了薄膜负温度系数热敏电阻的制造方法。 其包括选择基板，感温层，内电极，保护层和端电极。 温度敏感层是NTC薄膜，内部电极具有梳状结构。 可以通过改变不受热敏电阻物理尺寸的误差影响的梳状电极的材料组成和宽度，间隙，长度来调节本发明的电阻值。 在本发明中，高温釉料被接合以使廉价陶瓷基板的表面光滑。 该工艺降低了制造成本，改善了结构，提高了可靠性和产量，从而扩大了NTC薄膜热敏电阻芯片的应用范围。 本发明具有工业实用性。