Conductive Gasket
    2.
    发明申请
    Conductive Gasket 审中-公开
    导电垫片

    公开(公告)号:US20150124425A1

    公开(公告)日:2015-05-07

    申请号:US14072888

    申请日:2013-11-06

    CPC classification number: H05K9/0015

    Abstract: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least one interior surface may be devoid of the covering material.

    Abstract translation: 可以提供一种装置。 该装置可以包括设置在芯的一部分上的芯和覆盖材料。 至少一个开口可以设置在芯中。 至少一个开口可以暴露在芯上的至少一个内表面。 至少一个内表面可以没有覆盖材料。

    Enlarged Press-Fit Hole
    4.
    发明申请
    Enlarged Press-Fit Hole 审中-公开
    放大压孔

    公开(公告)号:US20150173181A1

    公开(公告)日:2015-06-18

    申请号:US14107069

    申请日:2013-12-16

    Abstract: An apparatus may be provided. The apparatus may comprise a circuit board and a bore. The circuit board may have a component side surface and a bottom side surface. The bore may be disposed in the circuit board. The bore may extent from the component side surface to the bottom side surface. The bore may comprise a first portion and a second portion. The first portion may have a first diameter. The second portion may be disposed between the first portion and the component side surface. The second portion may have a second diameter greater than the first diameter.

    Abstract translation: 可以提供一种装置。 该装置可以包括电路板和孔。 电路板可以具有部件侧表面和底侧表面。 孔可以设置在电路板中。 孔可以从部件侧表面到底侧表面。 孔可以包括第一部分和第二部分。 第一部分可以具有第一直径。 第二部分可以设置在第一部分和部件侧表面之间。 第二部分可以具有大于第一直径的第二直径。

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