公开(公告)号：US20240105549A1

公开(公告)日：2024-03-28

申请号：US18169609

申请日：2023-02-15

Applicant: Cisco Technology, Inc.

Inventor： Yongguo CHEN ,  Kai CAO ,  Hua YANG ,  Vic Hong CHIA ,  Paul TON

IPC: H01L23/427 ,  H01L23/00

CPC classification number: H01L23/4275 ,  H01L24/08 ,  H01L24/32 ,  H01L2224/08111 ,  H01L2224/32257 ,  H01L2224/32501 ,  H01L2924/1433

Abstract: The systems and cold plate pedestal and assembly described decrease mechanical stresses in integrated circuits, while also providing efficient thermal coupling between heat producing components and a cold plate. A cold plate assembly includes a cold plate with a pedestal portion a groove formed in a surface of the pedestal portion. The cold plate assembly also includes a thermal pad layer formed in the groove and a phase change material (PCM) layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.

公开(公告)号：US20230247799A1

公开(公告)日：2023-08-03

申请号：US17649589

申请日：2022-02-01

Applicant: Cisco Technology, Inc.

Inventor： Yongguo CHEN ,  Yaotsan TSAI ,  Vic Hong CHIA ,  Hua YANG ,  Kai CAO

IPC: H05K7/20

CPC classification number: H05K7/20409 ,  H05K7/20336

Abstract: An apparatus includes a heat pipe, a first fin, and a second fin. The heat pipe includes a first end and a second end. The heat pipe defines a chamber through which a fluid flows. The first fin is coupled to the heat pipe at the first end. The first fin is arranged to absorb heat from the fluid at the first end such that the fluid at the first end flows back towards the second end. The second fin is coupled to the heat pipe between the first fin and the second end. The second fin is arranged to absorb heat from the fluid as the fluid flows from the second end towards the first end.