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公开(公告)号:US07088574B2
公开(公告)日:2006-08-08
申请号:US10606277
申请日:2003-06-26
IPC分类号: G06F1/16
CPC分类号: B60R11/02 , G06F1/1632 , Y10S248/921
摘要: The present invention relates to a mounting apparatus for electronic device which is conformable to a surface contour of a support surface. The invention is directed to a mounting apparatus having a base with a deformable gel including weights and a support structure.
摘要翻译: 本发明涉及一种符合支撑面的表面轮廓的电子装置的安装装置。 本发明涉及一种安装设备,该安装设备具有带可变形凝胶的底座,该可变形凝胶包括重物和支撑结构。