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公开(公告)号：US20230086708A1
公开(公告)日：2023-03-23
申请号：US17949447
申请日：2022-09-21
Applicant: CommScope Technologies LLC
Inventor： Barry Wayne Allen , Jos Corstjens , Filip DF Ponsaerts
Abstract: The present disclosure relates to a housing having an interior and an exterior. The housing includes a first housing piece and a second housing piece that are coupled together by a joint. The joint includes a bonding material and the joint is configured such that when the bonding material is pressurized during formation of the joint the bonding material is predisposed to move toward the interior of the housing as compared to the exterior of the housing.
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