公开(公告)号：US20200060027A1

公开(公告)日：2020-02-20

申请号：US16429611

申请日：2019-06-03

Applicant: CommScope Technologies LLC

Inventor： Charles John Mann ,  Jiayong Wang ,  Qiwei Shi ,  Walter Mark Hendrix ,  Tri H. Nguyen

IPC: H05K5/00 ,  H05K5/06 ,  H05K7/18

Abstract: A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.

公开(公告)号：US11083093B2

公开(公告)日：2021-08-03

申请号：US16429611

申请日：2019-06-03

Applicant: CommScope Technologies LLC

Inventor： Charles John Mann ,  Jiayong Wang ,  Qiwei Shi ,  Walter Mark Hendrix ,  Tri H. Nguyen

IPC: H05K5/00 ,  H05K7/18 ,  H05K5/06 ,  H05K7/14

Abstract: A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.