公开(公告)号：US20220006182A1

公开(公告)日：2022-01-06

申请号：US17292569

申请日：2020-01-30

Applicant: CommScope Technologies LLC

Inventor： Xun ZHANG ,  Bo WU ,  Xiaotuo WANG ,  Ligang WU

IPC: H01Q1/52 ,  H01Q1/08 ,  H01Q19/10 ,  H01Q1/24 ,  H01Q9/28 ,  H01Q1/38 ,  H01Q21/26

Abstract: A radiator for an antenna comprises a radiating element having a radiating arm and a feed portion and a first dielectric structure configured to cover at least 50% of the radiating element, the dielectric structure having a dielectric constant of at least 3.0. The dielectric structure reduces a first electrical length of the radiating arm by at least 20% and also reduces a second electrical length of the feed portion by at least 20%.

公开(公告)号：US20210083423A1

公开(公告)日：2021-03-18

申请号：US16997290

申请日：2020-08-19

Applicant: CommScope Technologies LLC

Inventor： Zhigang WANG ,  Xun ZHANG ,  Ruixin SU

IPC: H01R13/625 ,  H01R13/635

Abstract: An integral SMP connector assembly for a base station antenna comprising a base, in which at least two SMP connectors are configured to extend away from a backplate of the base station antenna from an upper surface of the base, the base including: at least one connecting portion which connects the base to the backplate so that the upper surface of the base faces the backplate; and a close looped groove located in the upper surface of the base and surrounding the at least one connecting portion and the at least two SMP connectors. The integral SMP connector assembly further comprises a seal received in the groove and configured to provide an airtight seal between the upper surface of the base and the backplate.

公开(公告)号：US20220359995A1

公开(公告)日：2022-11-10

申请号：US17621623

申请日：2020-07-10

Applicant: CommScope Technologies LLC

Inventor： Xun ZHANG ,  Bo WU ,  Hangsheng WEN ,  Zhigang WANG ,  Jian ZHANG ,  Ligang WU

IPC: H01Q21/06 ,  H01Q21/00 ,  H01Q3/26 ,  H01Q9/04

Abstract: A patch antenna comprises a multilayer printed circuit board that includes a calibration network, an array of patch radiators and a feed network. In some embodiments, the multilayer printed circuit board includes a plurality of dielectric substrates, wherein the array of patch radiators is provided on a dielectric substrate different from the dielectric substrate on which the calibration network is provided, and the dielectric substrate provided with the array of patch radiators is provided above the dielectric substrate provided with the calibration network.