公开(公告)号：US20040115354A1

公开(公告)日：2004-06-17

申请号：US10700444

申请日：2003-11-05

Applicant: Commonwealth Scientific and Industrial Research Organisation

Inventor： Con Filippou ,  Wojciech Gutowski ,  David Proctor ,  Mark Spicer

IPC: B05D003/10

CPC classification number: B05D3/08 ,  B05D2201/00

Abstract: A process for modifying the surface of a substrate containing a polymeric material by contacting the surface with the modifying agent to bond the modifying agent to the surface the process comprising providing a solution of the modifying agent in a solvent and subjecting the solution of the modifying agent to a zone of elevated temperature to vaporize the solvent and provide diffuse contact between the modifying agent and the surface of the substrate.

Abstract translation: 一种通过使表面与改性剂接触来改性含有聚合物材料的基材的表面的方法，以将改性剂粘合到表面上，该方法包括提供改性剂在溶剂中的溶液并使改性剂的溶液 到高温区域以蒸发溶剂并提供改性剂与基材表面之间的扩散接触。