公开(公告)号：US20130208428A1

公开(公告)日：2013-08-15

申请号：US13762706

申请日：2013-02-08

Applicant: Cooper Technologies Company

Inventor： John T. Hui ,  Stephen D. Howes ,  Stephen J. Teves

IPC: H05K7/20 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K7/20418 ,  H05K5/0017 ,  H05K5/0217 ,  Y10T29/49826

Abstract: The rear cover of an electronics device is made up of two sections including an external heat sink and a rear cover frame. The electronics for the computing device are directly coupled to the heat sink section. The two sections are fastened together with a layer of cushioning material to simultaneously provide shock-vibration protection as well as efficient cooling of the electronics.

Abstract translation: 电子设备的后盖由包括外部散热器和后盖框架的两部分组成。 用于计算设备的电子器件直接耦合到散热器部分。 两个部分用一层缓冲材料紧固在一起，以同时提供冲击振动保护以及电子元件的有效冷却。