公开(公告)号：US20160334580A1

公开(公告)日：2016-11-17

申请号：US15153111

申请日：2016-05-12

Applicant: Corning Incorporated

Inventor： Peng Chen ,  Sheng Huang ,  Ming-Jun Li

IPC: G02B6/26

CPC classification number: G02B6/26 ,  G02B6/13

Abstract: A method for manufacturing an optical waveguide interconnect may comprise providing a substrate, irradiating portions of the substrate's interior volume by directing a processing laser beam into the substrate surface, thus defining one or more surfaces that function as optic components, forming an embedded waveguide in the interior volume by directing the processing laser beam into the substrate surface, and etching away the weakened portions of the substrate's interior volume overlying the defined surfaces using an etchant. The optic components and the waveguide may be aligned to be in optical communication with each other such that an input beam of light may strike the defined surface of a first optic component, traverse the waveguide, and strike the defined surface of a second optic component.

Abstract translation: 一种用于制造光波导互连的方法可以包括提供衬底，通过将处理激光束引导到衬底表面中来照射衬底的内部体积的一部分，从而限定一个或多个用作光学部件的表面，在其中形成嵌入式波导 通过将处理激光束引导到衬底表面中，并且使用蚀刻剂蚀刻掉覆盖在限定表面上的衬底的内部体积的弱化部分。 光学部件和波导可以被对齐以彼此光学连通，使得输入光束可以撞击第一光学部件的限定的表面，穿过波导并且撞击第二光学部件的限定的表面。